100% material declaration data sheet PQG208 pk123 (v1.2.1) october 19, 2006 material declaration data sheet average weight: 5.3 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.0689 1.30% silicon 7440-21-3 100.00 0.0689 die attach material 0.03127 0.59% silver 7440-22-4 78.00 0.0243906 epoxy (ep) trade secret 22.00 0.0068794 mold compound 4.52726 85.42% epoxy resin (ep) trade secret 9.00 0.4074534 phenolic resin trade secret 7.00 0.3169082 carbon black 1333-86-4 0.50 0.0226363 silica 60676-86-0 82.50 3.7349895 bismuth 7440-69-9 max 1.00 0.0452726 leadframe 0.62858 11.86% copper 7440-50-8 98.85 0.62135133 chromium 7440-47-3 0.30 0.00188574 tin 7440-31-5 0.25 0.00157145 zinc 7440-66-6 0.60 0.00377148 leadframe plating 0.0053 0.10% silver 7440-22-4 100.00 0.0053 bond wire 0.00689 0.13% gold 7440-57-5 100.00 0.00689 ext. plating 0.0318 0.60% tin 7440-31-5 100.00 0.0318 pk123 (v1.2.1) october 19, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? PQG208 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 3/08/06 1.0 initial release. 7/05/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. 10/19/06 1.2.1 editorial c hange; corrected typo in substance description. pk123 (v1.2.1) october 19, 2006
|
